Xponents offers complete design engineering capabilities, from full product design and development to manufacturing and test solutions.

Modular solutions include Mixed Memory, Flash and DSP which provides a high-density packaging solution for space constrained requirements. Xponents main strength is its ability to co-develop, procure, manufacture, test, program and deploy a subsystem or daughterboard while meeting customer requirements on time and within budget. Our in-house design team is available to provide assistance in custom product development, manufacturing and testing.